Solid State Devices Releases Hermetic Dual GaN FET PN SGF30E100Z8

La Mirada, CA – Solid State Devices, Inc. (SSDI) continues to expand its hermetic GaN Power FETs line with the SGF30E100Z8, a 1000 volt dual GaN FET. When used in a half bridge configuration, this device delivers 15 amps of continuous drain current, but can also be connected in parallel to achieve 30 amps. Similar to SSDI’s other GaN offerings, the very fast switching SGF30E100Z8 has a low gate charge of 10 nC max and a low RDS(on) of 160 mΩ typ.

Source: News 2020-09-21: SGF30E100Z8

Device Engineering Surge Protection System Components 

Trust DEI products to provide Surge Protection System Components in accordance with DO160. All of DEI’s ARINC 429 components and most all Discrete to Digital converters feature this protection.DEI’s new Surge Blocking Modules provide Bi-Directional DO160. They also meet Airbus A350XWB requirements and come in both a fused (and soon) a non-fused version. They’re ideal for protecting device I/O lines throughout an aircraft and feature SiC technology.

Source: DO-160 Surge Protection System Components | Device Engineering Inc.

Wafer Shipments Head for Record Increases 

Worldwide wafer shipments, as with most global IC market segments, are up and heading for record increases over the next 18 months, according to the latest in a series of rosy forecasts by a semiconductor industry group.

Source: Wafer Shipments Head for Record Increases | EE Times

Micross Components and SemiQ Sign Global Bare Die Distribution Agreement

Orlando, FL, October 15, 2020 – Micross Components, Inc. (“Micross”), the world’s largest supplier of value-added bare die and a leading global mission-critical microelectronic components and services provider for high-reliability markets and SemiQ, Inc., a developer and manufacturer of silicon carbide (SiC) power devices, modules and epitaxial wafers have signed a new agreement establishing Micross as an authorized worldwide supplier of SemiQ SiC products offered in Die Form.

Source: Micross Components and SemiQ Sign Global Bare Die Distribution Agreement – Micross

AMD Reported to Be Negotiating Purchase of Xilinx 

AMD is said to be negotiating to buy Xilinx, and a deal could come as soon as next week. If the two companies agree, the deal would likely be worth approximately $30 billion, according to The Wall Street Journal.The value of AMD shares has soared of late, which means it should be able to much more easily swing a deal, and pay largely in stock. The WSJ reported that AMD’s stock grew 89% this year, and the company now has a valuation over $100 billion. Xilinx, meanwhile, has had to contend with the vicissitudes of President Donald Trump’s trade war with China; it tried and failed to secure a dispensation to keep supplying Huawei.

Source: AMD Reported to Be Negotiating Purchase of Xilinx | EE Times

Thermal interface materials for extended EV battery lifespan 

Heat dissipation and thermal management are growing issues in the design of electric vehicles (EVs) and their components. Within the battery pack, heat is generated during the operation of the battery. However, batteries operate more efficiently and retain their capacity longer if their environment is maintained within a narrow range of temperature.

Source: Thermal interface materials for extended EV battery lifespan | Electronics360

Global semiconductor sales continue growth in August

Worldwide semiconductor sales registered an on-year increase for the seventh consecutive month in August 2020.The global semiconductor industry posted August sales of US$36.2 billion, up 3.6% sequentially, according to Semiconductor Industry Association (SIA). Sales were 4.9% above the August 2019 total of US$34.5 billion.”Global semiconductor sales increased year-to-year in August for the seventh consecutive month, demonstrating the global market so far has remained largely insulated from ongoing global macroeconomic headwinds, but there is still substantial uncertainty for the months ahead,” said John Neuffer, SIA president and CEO.

Source: Global semiconductor sales continue growth in August

Intel Wins US Government Advanced Packaging Project 

SANTA CLARA, Calif.–(BUSINESS WIRE)– What’s New: The U.S. Department of Defense has awarded Intel Federal LLC the second phase of its State-of-the-Art Heterogeneous Integration Prototype (SHIP) program. The SHIP program enables the U.S. government to access Intel’s state-of-the-art semiconductor packaging capabilities in Arizona and Oregon and take advantage of capabilities created by Intel’s tens of billions of dollars of annual R&D and manufacturing investment.

Source: Intel Wins US Government Advanced Packaging Project | Seeking Alpha

Momentum Builds For Advanced Packaging

The semiconductor industry is stepping up its efforts in advanced packaging, an approach that is becoming more widespread with new and complex chip designs.Foundries, OSATs and others are rolling out the next wave of advanced packaging technologies, such as 2.5D/3D, chiplets and fan-out, and they are developing more exotic packaging technologies that promise to improve performance, reduce power, and improve time to market. Each package type is different, with various tradeoffs. As before, the idea behind advanced packaging is to assemble complex dies in a package, creating a system-level design. But advanced packaging faces some technical and cost challenges.

Source: Momentum Builds For Advanced Packaging

Chip Industry Wants $50 Billion to Keep Manufacturing in U.S.

WASHINGTON—Sept. 16, 2020—The Semiconductor Industry Association (SIA), in partnership with the Boston Consulting Group (BCG), today released a study analyzing the impact of proposed federal incentives for domestic semiconductor manufacturing. The report, titled Government Incentives and U.S. Competitiveness in Semiconductor Manufacturing, finds robust federal incentives would reverse the decades-long trajectory of declining chip production in America and create as many as 19 major semiconductor manufacturing facilities (fabs) and 70,000 high-paying jobs in the U.S. over the next 10 years. Congress is considering legislation that calls for substantial investments in domestic semiconductor manufacturing and research. SIA represents 95 percent of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.

Source: Study Finds Federal Incentives for Domestic Semiconductor Manufacturing Would Strengthen America’s Chip Production, Economy, National Security, Supply Chains – Semiconductor Industry Association

It’s Official: Nvidia Buys Arm 

The announcement noted that SoftBank will remain committed to Arm’s long-term success through its ownership stake in Nvidia, expected to be under 10 percent.Nvidia is framing its mega business deal with Arm as “bringing Nvidia’s own AI computing platform to Arm’s vast ecosystem.”

Source: It’s Official: Nvidia Buys Arm | EE Times

CDE Expands its High-Energy Storage, Pulse-Discharge Film Capacitors

CDE Cornell Dubilier Electronics, Inc. announces a major product expansion of standard and custom high energy storage, pulse-discharge capacitors. These are specialized devices, designed for applications requiring repetitive high energy and high voltage charge/discharge cycles.

Source: CDE Expands its High-Energy Storage, Pulse-Discharge Film Capacitors