The semiconductor industry is stepping up its efforts in advanced packaging, an approach that is becoming more widespread with new and complex chip designs.Foundries, OSATs and others are rolling out the next wave of advanced packaging technologies, such as 2.5D/3D, chiplets and fan-out, and they are developing more exotic packaging technologies that promise to improve performance, reduce power, and improve time to market. Each package type is different, with various tradeoffs. As before, the idea behind advanced packaging is to assemble complex dies in a package, creating a system-level design. But advanced packaging faces some technical and cost challenges.
https://i0.wp.com/mtgelectronics.com/wp-content/uploads/2020/09/Chiplet1.png?fit=1314%2C1418&ssl=1 1418 1314 admin https://mtgelectronics.com/wp-content/uploads/2020/07/MTG-logo-for-site-300x100-1.png admin2020-09-18 10:11:502020-09-25 14:06:59Momentum Builds For Advanced Packaging
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