Creating demand through enabling technology solutions

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Business Development

Micro Technology Group is a New England based business development company providing technical marketing, business development and fulfillment services for manufacturers of electronic components, microelectronics circuits and related products. We provide innovative marketing and sales strategies for our principals leveraging their core competencies to win new customer designs resulting in increased revenue for our principals. Our mission is to bring an exceptional level of “service value” to our principals, customers and channel partners.

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Solid Body, Current Limiting Fuses QPL listed to FM12/P600L and Mil-PRF- 23419/12 ▪ High-Reliability Micro Fuses ▪ High-Reliability Ferrite Chip Beads for Mil-Aero Applications

Optoelectronic Sensors: Ambient Light Sensors, Color Sensors, LTD/LTF Sensors ▪ Smart Lightning Managers ▪ Gesture Sensors and Proximity Sen-sors ▪ 3D Sensors ▪ LED Drivers ▪ Time-of-Flight ▪ Spectral Sensors ▪ VCSEL Arrays ▪ Audio Sensors ▪ Power Management ICs ▪ Image Sensors ▪ Linear Arrays ▪ Magnetic and Inductive Position Sensors ▪ Bio-Sensors ▪ Custom Medical ASICs

ITAR Registered Supplier of Printed Circuit Boards ▪  High Current and Combination PCBs ▪  Copper Inlay PCBs for Power Semiconductor Applications ▪  Embedded Bus PCBs ▪  Metal Clad PCBs ▪  Polymer Thick-Film Resistive PCBs

LED Die, UV to Infrared, White and all wavelengths and Brightness Classes ▪ Custom Packaged LEDs ▪ Laser Diodes, Die and Bars ▪ Photo Diodes ▪Photo Transistors ▪ Detector Arrays ▪ Photo Sensitive Detectors ▪ Emitters ▪ High Power VCSEL Arrays ▪ Custom LED Modules

Linear/High Performance Accelerometers ▪ Dynamic Pressure Sensors ▪ Fiber Optic Pressure Seals ▪ Force Balance Incinometers ▪ L.V.D.T. Products ▪ Portable Vibration Meters ▪ Strain Sensors

ARINC 429, 571 and 575 Line Drivers, Receivers and Transceivers ▪ Power Conditioning Circuits ▪ Discrete-to-Digital Logic Conversion Circuits ▪ Bipolar Analog ASIC Arrays ▪ Custom Mil-AerospaceDiscrete ASIC Circuits

Semiconductors: Semiconductor Die- Schottky Diodes, Zeners, TVS, and MOSFETs ▪ DMS/EOL Solutions ▪  Wafer Sorting & Processing

Packaging & Assembly: Replacement of Siliconix MIL-PRF-38535 Devices ▪ Assembly Services

Die Testing: PEM Qualifications, Screening and Test Services, Device Analysis, Up-Screening

Electro Tecchnik
High Reliability Capacitors, Resistors and Magnetics

Semiconductors: Packaged Semiconductors, FPGAs, 3D ICs ▪ DMS/EOL Solutions ▪  Wafer Sorting & Processing

Packaging & Assembly: Enhanced Plastic and Chip-Scale Solutions ▪ Flip-Chip, MCM and SiP Packages ▪ Assembly Services

Component Modification: BGA Re-Balling ▪ GEIA Robotic Exchange for Leaded Components ▪ XRF and Mechanical Test Services

Testing: PEM Qualifications, Screening and Test Services, Device Analysis, Up-Screening

Micro-Beam Steering Solutions ▪ All-in-One Miniature Closed-Loop Motion Systems ▪ Squiggle and UTAF Piezo Motors ▪ M3-L Smart Actuators ▪ M3-L Linear Smart Stages ▪ M3-F and M3-FS Focus Modules

NFC Wireless Charging ICs • NFC Reader for POS & mPOS

FPGA IP Cores for Mil-Std-1553B, 1553-EBR, Mil-Std-1760, ARINC825 ▪ Mil- Std-1553 Transceivers, Transformers and Couplers ▪ Multi-Protocol Bus Testers and I/O cards for PCI, VME, PMC, PC104, SPI

Standard QPL Listed and Custom High Voltage Discrete Rectifiers, Bridges, Assemblies and Power Supplies ▪ QPL Power and High Voltage Discrete Semiconductors and Modules ▪ GaN and SiC Power FETs

High Current PCBs ▪ Thick Copper PCBs (105-240μm) ▪ Ultra Thick Copper PCBs (300-500μm) ▪ Ultra Max Thick Copper PCBs (1000μm) ▪ Combination PCBs ▪ Bus Bar Embedded PCBs ▪ Copper Inlay and Al Base PCBs

Ceramic SMPS Capacitors, High Voltage Radials, Tight Tolerance, Discoidals and Arrays ▪  QML Mil-PRF-49470, 87106 and DC 87040-88011 ▪ Safety Capacitors with UL and TUV Approvals ▪ High Voltage SMT Capacitors.

High-speed fab-less semiconductor solutions ▪   IP Libraries and algorithms that are highly silicon efficient with minimum power consumption possible ▪ Higher volumetric efficiency requiring less real estate and top class performance