Creating demand through enabling technology solutions

ARINC 429, 571 and 575 Line Drivers, Receivers and Transceivers ▪ Power Conditioning Circuits ▪ Discrete-to-Digital Logic Conversion Circuits ▪ Bipolar Analog ASIC Arrays ▪ Custom Mil-AerospaceDiscrete ASIC Circuits

Solid Body, Current Limiting Fuses QPL listed to FM12/P600L and Mil-PRF- 23419/12 ▪ High-Reliability Micro Fuses ▪ High-Reliability Ferrite Chip Beads for Mil-Aero Applications

Optoelectronic Sensors: Ambient Light Sensors, Color Sensors, LTD/LTF Sensors ▪ Smart Lightning Managers ▪ Gesture Sensors and Proximity Sen-sors ▪ 3D Sensors ▪ LED Drivers ▪ Time-of-Flight ▪ Spectral Sensors ▪ VCSEL Arrays ▪ Audio Sensors ▪ Power Management ICs ▪ Image Sensors ▪ Linear Arrays ▪ Magnetic and Inductive Position Sensors ▪ Bio-Sensors ▪ Custom Medical ASICs

Silicone/Non-Silicone Thermal Compounds for heat sink applications ▪ Mi-cro-Faze® Dry Film with Al/Kapton Carrier ▪ Sure-Form® Gap Filler ▪ Abso-lute Zero® Thermal Grease for semiconductor applications

ITAR Registered Supplier of Printed Circuit Boards ▪  High Current and Combination PCBs ▪  Copper Inlay PCBs for Power Semiconductor Applications ▪  Embedded Bus PCBs ▪  Metal Clad PCBs ▪  Polymer Thick-Film Resistive PCBs

Semiconductors: Wafers/Die ▪ DMS/EOL Solutions ▪ Wafer Dicing, Thin-ning, Stacking, Bumping , Probe and Inspection

Packaging & Assembly: Hermetic and High Temperature Packaging ▪ Chip- Scale Packaging ▪ Flip-Chip, MCM and SiP Packages ▪ Assembly Services

Component Modification: Lead-Attach, Component Modification ▪ Column Grid Arrays ▪ BGA Re-Balling ▪ GEIA Robotic Exchange for Leaded Compo-nents ▪ XRF and Mechanical Test Services

High Rel Products: High Reliability Products ▪ DLA 5962 Memory Solutions ▪ Retail+™ QML Equivalent Devices/AECQ-100 Automotive specification

Testing: PEM Qualifications ▪ Qualification/Space Level Testing for FPGAs ASICs and RF Circuits

Micro-beam Steering Solutions ▪ All-in-One Miniature Closed-Loop Motion Systems ▪ Squiggle and UTAF Piezo Motors ▪ M3-L Smart Actuators ▪ M3-L Linear Smart Stages ▪ M3-F and M3-FS Focus Modules

Complex Cable Harness Assemblies ▪  Coaxial/RF, Ribbon Cable, High Voltage, Flex and Braided Cable Assemblies ▪  Potted and Over-molded Assemblies ▪  Electro-Mechanical Assemblies ▪  IPC 620, Mil-Std-2000 and ITAR Registered

FPGA IP Cores for Mil-Std-1553B, 1553-EBR, Mil-Std-1760, ARINC825 ▪ Mil- Std-1553 Transceivers, Transformers and Couplers ▪ Multi-Protocol Bus Testers and I/O cards for PCI, VME, PMC, PC104, SPI

NFC Wireless Charging ICs • NFC Reader for POS & mPOS

Standard QPL Listed and Custom High Voltage Discrete Rectifiers, Bridges, Assemblies and Power Supplies ▪ QPL Power and High Voltage Discrete Semiconductors and Modules ▪ GaN and SiC Power FETs

High Current PCBs ▪ Thick Copper PCBs (105-240μm) ▪ Ultra Thick Copper PCBs (300-500μm) ▪ Ultra Max Thick Copper PCBs (1000μm) ▪ Combination PCBs ▪ Bus Bar Embedded PCBs ▪ Copper Inlay and Al Base PCBs

Ceramic SMPS Capacitors, High Voltage Radials, Tight Tolerance, Discoidals and Arrays ▪  QML Mil-PRF-49470, 87106 and DC 87040-88011 ▪ Safety Capacitors with UL and TUV Approvals ▪ High Voltage SMT Capacitors.