Creating demand through enabling technology solutions

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Business Development

Micro Technology Group is a New England based business development company that provides technical marketing and sales services for leading manufacturers of semiconductors, passive components, and related electronic component solutions. Micro Technology Group provides expertise for the electronic components industry. Our extensive knowledge of the electronics industry has helped drive our clients’ sales and market growth.

Achieve Your Business Development Goals

While our primary focus is providing business development and marketing services for manufacturers of electronic components, we have enhanced our services to include our innovative strategy of providing fulfillment services four our suppliers requiring a more efficient channel of supporting the Americas region.  We offer a best in class strategy for winning new designs!

By clearly identifying each supplier’s core competencies and target markets, we develop a strategy that allows all stakeholders to optimize return on investment. We implement a strategy of mapping supplier’s technologies and focused products with targeted end markets and technology clusters. Our expertise helps us bring an extraordinary level of service value to achieve the best possible outcomes for our customers and channel partners.

Why Choose Us?

Micro Technology Group – considered thought leaders in the electronic component industry – was founded in 1997 to provide electronic component manufacturers with a novel approach to business development.

Our company’s value and growth hinges upon strong business development strategies, such as relationship building, brand awareness, and market knowledge.

With 25 years serving the electronic component industry through its various change cycles, we remain committed to serving our client’s business goals.

  1. We are manufacturers’ representatives, and we provide enabling technology solutions which prove beneficial to our customers.
  2. Our industry expertise has allowed us to balance our customer needs, the design cycle, and the necessary return on investment required for winning new customer designs.
  3. We leverage our industry relationships and constantly develop new strategies for our clients to successfully expand their businesses.
  4. Our staff of professionals hold technical degrees and are committed to providing constant, consistent top-quality service.
  5. Our account managers are adept professionals who have an average of over twenty-five years’ experience of actively selling electronic components as well as senior level management positions with OEM manufacturers.
  6. Our in-depth understanding of the manufacturing environment enhances our ability to serve our suppliers, customers, and channel partners.
  7. Philanthropy is our core philosophy – Giving back to our community is an integral part of our mission.

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Solid Body, Current Limiting Fuses QPL listed to FM12/P600L and Mil-PRF- 23419/12 ▪ High-Reliability Micro Fuses ▪ High-Reliability Ferrite Chip Beads for Mil-Aero Applications

Robotic Solder Dipping per GEIA-006 • BGA Reballing • Re-Tinning and Lead • Gold Embrittlement Mitigation • Counterfeit Mitigation • XRF Analysis •  X-Ray Inspection Services

▪ LED Die, UV to Infrared, White and all wavelengths and Brightness Classes ▪ Custom Packaged LEDs▪ Laser Diodes, Die and Bars▪ Photo Diodes▪ Photo Transistors▪ Detector Arrays▪ Photo Sensitive Detectors▪ Emitters▪ High Power VCSEL Arrays▪ Custom LED Modules

Linear/High Performance Accelerometers ▪ Dynamic Pressure Sensors ▪ Fiber Optic Pressure Seals ▪ Force Balance Incinometers ▪ L.V.D.T. Products ▪ Portable Vibration Meters ▪ Strain Sensors

ARINC 429, 571 and 575 Line Drivers, Receivers and Transceivers ▪ Power Conditioning Circuits ▪ Discrete-to-Digital Logic Conversion Circuits ▪ Bipolar Analog ASIC Arrays ▪ Custom Mil-AerospaceDiscrete ASIC Circuits

Electro Tecchnik
High Reliability Capacitors, Resistors and Magnetics

Micro-Beam Steering Solutions ▪ All-in-One Miniature Closed-Loop Motion Systems ▪ Squiggle and UTAF Piezo Motors ▪ M3-L Smart Actuators ▪ M3-L Linear Smart Stages ▪ M3-F and M3-FS Focus Modules

NFC Wireless Charging ICs • NFC Reader for POS & mPOS

Analog TO-39, 1-4 Channel  Flame and Hydrocarbon Sensors ▪ezPyro SMD Single & Dual  for Flame, Gesture, IR Gas, Motion and Broadband Filter Sensors▪ Linear Arrays 128/128+1/255/510 Elements▪ Linear Array MSDS for ZnSe Crystal Option


Semiconductors: Packaged Semiconductors, FPGAs, 3D ICs ▪ DMS/EOL Solutions ▪  Wafer Sorting & Processing

Packaging & Assembly: Enhanced Plastic and Chip-Scale Solutions ▪ Flip-Chip, MCM and SiP Packages ▪ Assembly Services

Component Modification: BGA Re-Balling ▪ GEIA Robotic Exchange for Leaded Components ▪ XRF and Mechanical Test Services

Testing: PEM Qualifications, Screening and Test Services, Device Analysis, Up-Screening

Discrete and Integrated Circuit Re-hosting ▪ Discrete Array ICs ▪ Linear ICs ▪ End-of-Life Die Inventory

Standard QPL Listed and Custom High Voltage Discrete Rectifiers, Bridges, Assemblies and Power Supplies ▪ QPL Power and High Voltage Discrete Semiconductors and Modules ▪ GaN and SiC Power FETs

High Current PCBs ▪ Thick Copper PCBs (105-240μm) ▪ Ultra Thick Copper PCBs (300-500μm) ▪ Ultra Max Thick Copper PCBs (1000μm) ▪ Combination PCBs ▪ Bus Bar Embedded PCBs ▪ Copper Inlay and Al Base PCBs

Ceramic SMPS Capacitors, High Voltage Radials, Tight Tolerance, Discoidals and Arrays ▪  QML Mil-PRF-49470, 87106 and DC 87040-88011 ▪ Safety Capacitors with UL and TUV Approvals ▪ High Voltage SMT Capacitors.

High-speed fab-less semiconductor solutions ▪   IP Libraries and algorithms that are highly silicon efficient with minimum power consumption possible ▪ Higher volumetric efficiency requiring less real estate and top class performance