Creating demand through enabling technology solutions

Solid Body, Current Limiting Fuses QPL listed to FM12/P600L and Mil-PRF- 23419/12 ▪ High-Reliability Micro Fuses ▪ High-Reliability Ferrite Chip Beads for Mil-Aero Applications

Optoelectronic Sensors: Ambient Light Sensors, Color Sensors, LTD/LTF Sensors ▪ Smart Lightning Managers ▪ Gesture Sensors and Proximity Sen-sors ▪ 3D Sensors ▪ LED Drivers ▪ Time-of-Flight ▪ Spectral Sensors ▪ VCSEL Arrays ▪ Audio Sensors ▪ Power Management ICs ▪ Image Sensors ▪ Linear Arrays ▪ Magnetic and Inductive Position Sensors ▪ Bio-Sensors ▪ Custom Medical ASICs

Robotic Solder Dipping per GEIA-006 • BGA Reballing • Re-Tinning and Lead • Gold Embrittlement Mitigation • Counterfeit Mitigation • XRF Analysis •  X-Ray Inspection Services

▪ LED Die, UV to Infrared, White and all wavelengths and Brightness Classes ▪ Custom Packaged LEDs▪ Laser Diodes, Die and Bars▪ Photo Diodes▪ Photo Transistors▪ Detector Arrays▪ Photo Sensitive Detectors▪ Emitters▪ High Power VCSEL Arrays▪ Custom LED Modules

Linear/High Performance Accelerometers ▪ Dynamic Pressure Sensors ▪ Fiber Optic Pressure Seals ▪ Force Balance Incinometers ▪ L.V.D.T. Products ▪ Portable Vibration Meters ▪ Strain Sensors

ARINC 429, 571 and 575 Line Drivers, Receivers and Transceivers ▪ Power Conditioning Circuits ▪ Discrete-to-Digital Logic Conversion Circuits ▪ Bipolar Analog ASIC Arrays ▪ Custom Mil-AerospaceDiscrete ASIC Circuits

Micro-Beam Steering Solutions ▪ All-in-One Miniature Closed-Loop Motion Systems ▪ Squiggle and UTAF Piezo Motors ▪ M3-L Smart Actuators ▪ M3-L Linear Smart Stages ▪ M3-F and M3-FS Focus Modules

NFC Wireless Charging ICs • NFC Reader for POS & mPOS

Semiconductors: Packaged Semiconductors, FPGAs, 3D ICs ▪ DMS/EOL Solutions ▪  Wafer Sorting & Processing

Packaging & Assembly: Enhanced Plastic and Chip-Scale Solutions ▪ Flip-Chip, MCM and SiP Packages ▪ Assembly Services

Component Modification: BGA Re-Balling ▪ GEIA Robotic Exchange for Leaded Components ▪ XRF and Mechanical Test Services

Testing: PEM Qualifications, Screening and Test Services, Device Analysis, Up-Screening

FPGA IP Cores for Mil-Std-1553B, 1553-EBR, Mil-Std-1760, ARINC825 ▪ Mil- Std-1553 Transceivers, Transformers and Couplers ▪ Multi-Protocol Bus Testers and I/O cards for PCI, VME, PMC, PC104, SPI

Standard QPL Listed and Custom High Voltage Discrete Rectifiers, Bridges, Assemblies and Power Supplies ▪ QPL Power and High Voltage Discrete Semiconductors and Modules ▪ GaN and SiC Power FETs

High Current PCBs ▪ Thick Copper PCBs (105-240μm) ▪ Ultra Thick Copper PCBs (300-500μm) ▪ Ultra Max Thick Copper PCBs (1000μm) ▪ Combination PCBs ▪ Bus Bar Embedded PCBs ▪ Copper Inlay and Al Base PCBs

Ceramic SMPS Capacitors, High Voltage Radials, Tight Tolerance, Discoidals and Arrays ▪  QML Mil-PRF-49470, 87106 and DC 87040-88011 ▪ Safety Capacitors with UL and TUV Approvals ▪ High Voltage SMT Capacitors.

High-speed fab-less semiconductor solutions ▪   IP Libraries and algorithms that are highly silicon efficient with minimum power consumption possible ▪ Higher volumetric efficiency requiring less real estate and top class performance