Creating demand through enabling technology solutions

Business Development

Micro Technology Group is a New England based  manufacturers’ representative providing technical marketing and business development services to manufacturers of semiconductors, passive and electro-mechanical components and related services. We develop and implement marketing and sales strategies for our principals leveraging their core competencies to win new customer applications resulting in increased revenue for our principals. Our mission is to bring an exceptional level of “service value” to our principals, customers and channel partners.

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Solid Body, Current Limiting Fuses QPL listed to FM12/P600L and Mil-PRF- 23419/12 ▪ High-Reliability Micro Fuses ▪ High-Reliability Ferrite Chip Beads for Mil-Aero Applications

Optoelectronic Sensors: Ambient Light Sensors, Color Sensors, LTD/LTF Sensors ▪ Smart Lightning Managers ▪ Gesture Sensors and Proximity Sen-sors ▪ 3D Sensors ▪ LED Drivers ▪ Time-of-Flight ▪ Spectral Sensors ▪ VCSEL Arrays ▪ Audio Sensors ▪ Power Management ICs ▪ Image Sensors ▪ Linear Arrays ▪ Magnetic and Inductive Position Sensors ▪ Bio-Sensors ▪ Custom Medical ASICs

Silicone/Non-Silicone Thermal Compounds for heat sink applications ▪ Mi-cro-Faze® Dry Film with Al/Kapton Carrier ▪ Sure-Form® Gap Filler ▪ Abso-lute Zero® Thermal Grease for semiconductor applications

ITAR Registered Supplier of Printed Circuit Boards ▪  High Current and Combination PCBs ▪  Copper Inlay PCBs for Power Semiconductor Applications ▪  Embedded Bus PCBs ▪  Metal Clad PCBs ▪  Polymer Thick-Film Resistive PCBs

ARINC 429, 571 and 575 Line Drivers, Receivers and Transceivers ▪ Power Conditioning Circuits ▪ Discrete-to-Digital Logic Conversion Circuits ▪ Bipolar Analog ASIC Arrays ▪ Custom Mil-AerospaceDiscrete ASIC Circuits

High Reliability Capacitors, Resistors and Magnetics

Semiconductors: Wafers/Die ▪ DMS/EOL Solutions ▪ Wafer Dicing, Thin-ning, Stacking, Bumping , Probe and Inspection

Packaging & Assembly: Hermetic and High Temperature Packaging ▪ Chip- Scale Packaging ▪ Flip-Chip, MCM and SiP Packages ▪ Assembly Services

Component Modification: Lead-Attach, Component Modification ▪ Column Grid Arrays ▪ BGA Re-Balling ▪ GEIA Robotic Exchange for Leaded Compo-nents ▪ XRF and Mechanical Test Services

High Rel Products: High Reliability Products ▪ DLA 5962 Memory Solutions ▪ Retail+™ QML Equivalent Devices/AECQ-100 Automotive specification

Testing: PEM Qualifications ▪ Qualification/Space Level Testing for FPGAs ASICs and RF Circuits

Micro-beam Steering Solutions ▪ All-in-One Miniature Closed-Loop Motion Systems ▪ Squiggle and UTAF Piezo Motors ▪ M3-L Smart Actuators ▪ M3-L Linear Smart Stages ▪ M3-F and M3-FS Focus Modules

Complex Cable Harness Assemblies ▪  Coaxial/RF, Ribbon Cable, High Voltage, Flex and Braided Cable Assemblies ▪  Potted and Over-molded Assemblies ▪  Electro-Mechanical Assemblies ▪  IPC 620, Mil-Std-2000 and ITAR Registered

FPGA IP Cores for Mil-Std-1553B, 1553-EBR, Mil-Std-1760, ARINC825 ▪ Mil- Std-1553 Transceivers, Transformers and Couplers ▪ Multi-Protocol Bus Testers and I/O cards for PCI, VME, PMC, PC104, SPI

Standard QPL Listed and Custom High Voltage Discrete Rectifiers, Bridges, Assemblies and Power Supplies ▪ QPL Power and High Voltage Discrete Semiconductors and Modules ▪ GaN and SiC Power FETs

High Current PCBs ▪ Thick Copper PCBs (105-240μm) ▪ Ultra Thick Copper PCBs (300-500μm) ▪ Ultra Max Thick Copper PCBs (1000μm) ▪ Combination PCBs ▪ Bus Bar Embedded PCBs ▪ Copper Inlay and Al Base PCBs

Ceramic SMPS Capacitors, High Voltage Radials, Tight Tolerance, Discoidals and Arrays ▪  QML Mil-PRF-49470, 87106 and DC 87040-88011 ▪ Safety Capacitors with UL and TUV Approvals ▪ High Voltage SMT Capacitors.