SANTA CLARA, Calif.–(BUSINESS WIRE)– What’s New: The U.S. Department of Defense has awarded Intel Federal LLC the second phase of its State-of-the-Art Heterogeneous Integration Prototype (SHIP) program. The SHIP program enables the U.S. government to access Intel’s state-of-the-art semiconductor packaging capabilities in Arizona and Oregon and take advantage of capabilities created by Intel’s tens of billions of dollars of annual R&D and manufacturing investment.
https://i1.wp.com/mtgelectronics.com/wp-content/uploads/2020/10/Intel-CWS.jpeg?fit=256%2C192&ssl=1 192 256 admin https://mtgelectronics.com/wp-content/uploads/2020/07/MTG-logo-for-site-300x100-1.png admin2020-10-02 09:54:432020-10-02 09:59:48Intel Wins US Government Advanced Packaging Project
- Electrified Vehicles: The Race to Mass AdoptionJanuary 21, 2021 - 5:02 pm
- CRL Announces Strain Sensor for Curved Mounting SurfacesJanuary 20, 2021 - 1:05 pm
- Murata Announced Completion of New Raw Ceramic Manufacturing Plant January 20, 2021 - 10:31 am
- Romanian government approves Naval Strike Missile buy from RaytheonJanuary 16, 2021 - 11:38 am