SENIS Current Sensor for High Speed and High Accuracy Apps

The SENIS® SENCS1D02 is a programmable current sensor that uses a combination of linear Hall sensor and Coil to increase the measurement bandwidth and to improve the signal-to-noise ratio, i.e. to increase resolution. This combination allows the highest frequency bandwidth of this kind of sensor on the market. The sensor provides and analog output voltage proportional to the applied magnetic field density. The transfer characteristic of the sensor is factory trimmed over temperature and is programmable (offset, sensitivity, filtering…) during end-of-line customer calibration beyond
the default factory trimming. In a typical current sensing application, the sensor is used in a combination with a ring shaped soft ferromagnetic core. This core is recommended to be ferrite or laminated for high bandwidth applications.

MTG will be stocking both the SENCS1D02 Current Sensor ICs as well as the application’s specific evaluation boards and kits.  We will maintain inventory on the 10mT and 100mT ranges with X and Z sensitivity. Contact us for more details.

The next frontier of electro-optical sensors

Electro-optical sensors — those that sense light at a variety of different spectra — enable warfighters to see at night, detect disturbed soil that might suggest the presence of roadside bombs, detect missile launches, and find tiny boats at sea. While these sensors bolster the U.S. military claims to “own the night,” the battlefield capabilities that modern electro-optical sensors offer are poised for revolutionary improvements that promise to increase sensor ranges; enhance image resolution; reduce sensor size, weight, and power consumption (SWaP); and identify targets automatically through artificial intelligence (AI).

Source: The next frontier of electro-optical sensors | Military Aerospace

Global semiconductor equipment sales to reach US$124B in 2025

Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach US$100 billion in 2023, a contraction of 6.1% from the industry record of US$107.4 billion posted in 2022, according to SEMI. Semiconductor manufacturing equipment growth is expected to resume in 2024, with sales forecast to reach a new high of US$124 billion in 2025, supported by both the front-end and back-end segments, SEMI indicated.

Source: Global semiconductor equipment sales to reach record US$124 billion in 2025, says SEMI

Military seeks to start domestic research center for 3DHI microelectronics development

ARLINGTON, Va. – U.S. military electronics experts are reaching out to industry for information to help them establish a domestic research center for fabrication of three-dimensional heterogeneously integrated (3DHI) microsystems. Officials of the U.S. Defense Advanced Research Projects Agency in Arlington, Va., issued a request for information on Friday (DARPA-SN-23-84) for the Establishing a Domestic Center for R&D and Manufacturing 3-D Heterogeneous Integration (3DHI) Microsystems project.

Source: research center 3DHI manufacturing | Military Aerospace

Global Silicon Wafer Shipment Growth to Bounce Back in 2024 

MILPITAS, Calif. ─ October 26, 2023 ─ Global shipments of silicon wafers are projected to decline 14% in 2023, to 12,512 million square inches (MSI) from the record high of 14,565 MSI in 2022 before bouncing back in 2024 as wafer and semiconductor demand recovers and inventory levels normalize, SEMI reported today in its annual silicon shipment forecast. Continuing softness in demand for semiconductors and challenging macroeconomic conditions are driving the 2023 decline.

Source: Global Silicon Wafer Shipment Growth to Bounce Back in 2024 After 2023 Decline, SEMI Reports | SEMI

Broadcom SiPM Evaluation PCBs in Stock

Electroverge® now has stock on Broadcom’s AFBR-S4PEPCBDC DC readout evaluation PCB. This kit supports fast testing our Broadcom’s SiPMs and is compatible with Thorlabs cage mount systems SM1 for easy mounting and alignment into optical systems.  Included in our stocking package are the following SiPMs on interposer PCB: AFBR-S4N22P014M (2 mm X 2 mm), AFBR-S4N44P014M (4 mm X 4 mm), and AFBR-S4N66P014M (6 mm X 6 mm).  Features include DC Readout over 50Ω load resistor, Compatible with ThorLabs SM1 cage mounting system, and Carrier PCB is compatible with ABFR-S4E001 evaluation kit. Available SiPM on interposer PCB for multiple parts. Kit available only for evaluation purposes. > Order Now

Source: Electroverge

Gearing Up For Hybrid Bonding

Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking chip-lets vertically in direct wafer-to-wafer bonds, chipmakers can leapfrog attainable interconnection pitch from 35µm in copper micro-bumps to 10µm or less. That reduces signal delay to negligible levels and enables smaller, thinner packages with faster memory/processor speeds — and all of this while consuming less power.

Source: Gearing Up For Hybrid Bonding

Micro Two-Axis Two-Mirror System Uses Piezo Smart Stages

The new DK-M3-RS-U2-2M-20-L Developer’s Kit features two M3-RS-U2 Rotary Smart Stages with built-in controllers. It is ideal for precise, point-to-point beam steering in a limited space, with dynamic positioning up to 100 Hz. The 3.3 VDC input makes it suited for handheld/portable instruments. The kit includes two Smart Stages mounted in a base, two mirrors, a 650nm laser, a demo board and cables for evaluation and PC connection, and New Scale’s powerful Pathway Software for development.

Source: NEW Beam Steering Dev Kit: Micro Two-Axis Two-Mirror System Uses Piezo Smart Stages

Senis AG signs MTG to promote Magnetic Position Sensors

SENIS AG, Switzerland is a leading company that provides smart and accurate sensors and instruments for magnetic field and electric current measurements has engaged with Micro Technology Group to promote its magnetic position sensors in the US market.  SENIS® is ISO 9001 and ISO 22301 (Business Continuity Management) certified. Our calibration laboratory is ISO17025:2017 accredited.

Source: Company – Senis AG

VIDEO: M3-RS-U2-4.5-360 Rotary Microstage Developer’s Kit 

Rotary micropositioning stage is only 12 mm diameter including embedded controller. It offers 360 degrees continuous rotation at up to 1,100 degrees/second with an accuracy of 0.25 degrees.

Source: VIDEO: M3-RS-U2-4.5-360 Rotary Microstage Developer’s Kit – New Scale Technologies

New Scale offers rotary microstage with smallest system size and fastest integration 

New Scale Technologies, Inc. today announced its M3-RS-U2-4.5-360 Rotary Smart Stage, a miniature positioning module that simplifies the task of embedding high-precision rotary motion into scientific and industrial instruments. The latest addition to the M3 Smart Stage family features lower cost for high-volume production. It provides point-to-point angular positioning with closed-loop resolution better than 0.022 degrees and bandwidth of ~100 Hz.

Source: New rotary microstage delivers smallest system size and fastest integration for precision embedded motion in smaller, more powerful instruments – New Scale Technologies

The State of SiC: A Roundup of SiC Supply Cuts, Booms, and More

While some companies are scaling back SiC procurement in response to supply chain constraints, others are ramping up manufacturing and even developing SiC-focused simulation software.

Source: The State of SiC: A Roundup of SiC Supply Cuts, Booms, and More – News