Micross Components and SemiQ Sign Global Bare Die Distribution Agreement

Orlando, FL, October 15, 2020 – Micross Components, Inc. (“Micross”), the world’s largest supplier of value-added bare die and a leading global mission-critical microelectronic components and services provider for high-reliability markets and SemiQ, Inc., a developer and manufacturer of silicon carbide (SiC) power devices, modules and epitaxial wafers have signed a new agreement establishing Micross as an authorized worldwide supplier of SemiQ SiC products offered in Die Form.

Source: Micross Components and SemiQ Sign Global Bare Die Distribution Agreement – Micross