Micross Components and SemiQ Sign Global Bare Die Distribution Agreement

Orlando, FL, October 15, 2020 – Micross Components, Inc. (“Micross”), the world’s largest supplier of value-added bare die and a leading global mission-critical microelectronic components and services provider for high-reliability markets and SemiQ, Inc., a developer and manufacturer of silicon carbide (SiC) power devices, modules and epitaxial wafers have signed a new agreement establishing Micross as an authorized worldwide supplier of SemiQ SiC products offered in Die Form.

Source: Micross Components and SemiQ Sign Global Bare Die Distribution Agreement – Micross

Intel Wins US Government Advanced Packaging Project 

SANTA CLARA, Calif.–(BUSINESS WIRE)– What’s New: The U.S. Department of Defense has awarded Intel Federal LLC the second phase of its State-of-the-Art Heterogeneous Integration Prototype (SHIP) program. The SHIP program enables the U.S. government to access Intel’s state-of-the-art semiconductor packaging capabilities in Arizona and Oregon and take advantage of capabilities created by Intel’s tens of billions of dollars of annual R&D and manufacturing investment.

Source: Intel Wins US Government Advanced Packaging Project | Seeking Alpha

Momentum Builds For Advanced Packaging

The semiconductor industry is stepping up its efforts in advanced packaging, an approach that is becoming more widespread with new and complex chip designs.Foundries, OSATs and others are rolling out the next wave of advanced packaging technologies, such as 2.5D/3D, chiplets and fan-out, and they are developing more exotic packaging technologies that promise to improve performance, reduce power, and improve time to market. Each package type is different, with various tradeoffs. As before, the idea behind advanced packaging is to assemble complex dies in a package, creating a system-level design. But advanced packaging faces some technical and cost challenges.

Source: Momentum Builds For Advanced Packaging

Survey in 3D Electronics Alternative to PCBs 

Mention an electronic circuit and you are likely to picture a printed circuit board (PCB): a rigid rectangle in a characteristic green color with copper lines and a bewildering array of components soldered onto it. But does adding electronic functionality means using a PCB and thus requires shoehorning a rigid rectangle into the product?

Source: Survey in 3D Electronics Alternative to PCBs – Passive Components Blog

Micross AIT Receives DMEA Microelectronics Trusted Source Certification 

Orlando, FL, January 15, 2020 – Micross is pleased to announce that its Advanced Interconnect Technology operation (Micross AIT) located in Research Triangle Park, North Carolina has been accredited by the Defense Microelectronics Activity (DMEA) as a Microelectronics Trusted Source for Post CMOS Processing Services (Category 1A) effective December 13, 2019.

Source: Micross Advanced Interconnect Technology Receives DMEA Microelectronics Trusted Source Certification – Micross

Choosing Between 2D and 3D Materials for Next-Gen Semiconductors 

Researchers at Pohang University of Science and Technology (POSTECH) exploit resistive switching property in halide perovskite materials to develop the basis for a new type of fast, low-power, nonvolatile memory. Halide perovskite materials exhibit a resistive switching property, which means that with the application of a voltage, the substance’s resistance will change.

Source: Choosing Between 2D and 3D Materials to Set Off the Commercialization of Next-Gen Semiconductors – News

Micro-Precision Technologies acquired by Aerospace Semiconductor 

Feb 28, 2020 – Micro-Precision Technologies, Inc., (MPT) a Salem, NH Defense company was acquired by Aerospace Semiconductor, Inc. (ASI) of Lawrence, MA.  Going forward the company will operate under the Micro-Precision Technology, Inc. name in Salem, NH with a DBA registered for the Aerospace Semiconductor, Inc. name in Lawrence, MA.

Source: Micro-Precision Technologies, Inc. acquired by Aerospace Semiconductor, Inc. | Micro Precision Technology

Next Challenge: Known Good Systems

The leading edge of design is heading toward multi-die/multi-chiplet architectures, and an increasing number of mainstream designs likely will follow as processing moves closer to the edge.This doesn’t mean every chipmaker will be designing leading-edge chips, of course. But more devices will have at least some leading-edge logic or will be connected over some advanced interconnect scheme to one or more of those leading-edge chips or chiplets. The challenge will be verifying and debugging all of these devices in the context of how they will be used, and then testing them repeatedly in the lab, in manufacturing, during and after packaging, and for as long as they are used in the field.

Source: Next Challenge: Known Good Systems

Rochester Electronics Partners with ISSI Broadening Offering

 

Rochester is excited to announce our partnership with Integrated Silicon Solution Inc. ISSI are technology leaders designing and developing high-performance integrated circuits for the industrial, medical, automotive, and communications markets. Their focus on high-speed and low power SRAM, low and medium density DRAM and NOR flash memory align closely with our strategy to expand our solution offering forour global customers.

Source: Rochester Electronics Partners with Integrated Silicon Solution Inc. (ISSI) Broadening our Global Offering in SRAM, DRAM, and NOR Flash Memory – Electronics