For chipmakers, this means special attention needs to be paid to the design, layout, manufacturing processes, and testing of these ICs. The demand for higher integration, smaller size, and better power efficiency also is contributing to new challenges in rad-hard IC development.The most recent space program to test these mission-critical components is the Mars 2020 Perseverance rover. “Deep space is a challenging environment for spaceflight and Mars rover systems, particularly due to the intense radiation environment encountered in nearly all mission profiles,” said Josh Broline, director of marketing applications at Renesas Electronics Corp. “For product development, the biggest challenge is not necessarily the general performance of the IC but, rather, meeting that performance in a radiation environment.”
Source: Space Radiation Poses Challenge for Electronics – EE Times Asia