ORLANDO, May 5, 2020 — Micross Components, Inc. (“Micross”), a leading global provider of mission-critical microelectronic components and services for high-reliability markets announces further progress in its strategic integration with Corfin Industries, LLC (“Corfin”), an industry-recognized leader in proprietary processes and technologies such as Robotic Hot Solder Dip (RHSD) Technology, innovative component preparation/modification solutions plus BGA Reballing/Deballing and trim & form services.
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