ORLANDO, May 5, 2020 — Micross Components, Inc. (“Micross”), a leading global provider of mission-critical microelectronic components and services for high-reliability markets announces further progress in its strategic integration with Corfin Industries, LLC (“Corfin”), an industry-recognized leader in proprietary processes and technologies such as Robotic Hot Solder Dip (RHSD) Technology, innovative component preparation/modification solutions plus BGA Reballing/Deballing and trim & form services.
https://i0.wp.com/mtgelectronics.com/wp-content/uploads/2020/06/Corfin-Hot-Solder-Dip.jpg?fit=484%2C312&ssl=1 312 484 admin https://mtgelectronics.com/wp-content/uploads/2020/07/MTG-logo-for-site-300x100-1.png admin2020-06-04 08:02:312020-06-24 18:32:06Corfin Industries Is Now a Division of Micross Components
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