Wafer bumps need to be uniform in height to facilitate subsequent manufacturing steps, but a push for 100% inspection in packaging in mission-critical markets is putting a strain on existing measurement technologies.
https://i0.wp.com/mtgelectronics.com/wp-content/uploads/2021/08/Product-3.jpg?fit=500%2C333&ssl=1 333 500 admin https://mtgelectronics.com/wp-content/uploads/2021/03/MTG-logo-for-site-300x100-1.png admin2021-08-12 10:28:162021-08-12 10:35:51Why Wafer Bumps Are Suddenly So Important
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