The Transistor at 75: The First Makers, Part 2 

Part 1 of this article discussed the spark that ignited the commercial semiconductor industry. It was the 1952 Transistor Symposium conducted by Bell Telephone Laboratories (BTL). A book published by BTL called A History of Engineering and Science in the Bell System: Electronics Technology (1925-1975) stated that twenty-six domestic and fourteen foreign transistor licensees of the BTL transistor patents attended the symposium.

Source: The Transistor at 75: The First Makers, Part 2 – EEJournal

The Transistor at 75: The First Makers, Part 1 

Last November, our industry celebrated the 75th anniversary of the announcement by Bell Telephone Labs (BTL) of the transistor’s birth. I knew that many facets of the transistor’s invention would be well covered so I didn’t plan to add an article to this pile because I didn’t feel I had much to improve upon what would be written. However, I did read several of these articles including the excellent article titled “The Surface State Job,” written by my friend David Laws – writer, photographer, and Semiconductor Curator at the Computer History Museum. What I read made me ask one simple question. At least, I thought it was a question with a simple answer.

Source: The Transistor at 75: The First Makers, Part 1 – EEJournal

Panthronics Introduces Single-Chip Solution for NFC Wireless Battery Charging

Panthronics AG has released the industry’s first integrated, single-chip solution for the listener circuit in NFC wireless charging systems. The PTX30W is an integrated solution that is easier to implement than a circuit made of multiple discrete components. The fully autonomous chipset runs an NFC Forum-derived wireless charging protocol that supports power negotiation. This means that the PTX30W can operate in stand-alone mode with no need for an external microcontroller to run NFC wireless charging operations.

Source: Panthronics Introduces Single-Chip Solution for NFC Wireless Battery Charging

China’s semiconductor sales fall 21% in November as WW demand declines

China’s semiconductor sales plunged 21.2 per cent year on year to US$13.4 billion in November, as economic headwinds continued to hammer global chip demand for the third consecutive month, according to the latest industry data. The decline recorded by China marked the biggest percentage drop among the world’s major markets for integrated circuits (ICs), according to data from the Semiconductor Industry Association (SIA), a Washington-based trade group that represents 99 per cent of the US chip industry.

Source: China’s semiconductor sales fall 21 per cent in November as worldwide chip demand continues decline for third consecutive month | South China Morning Post

Global Semiconductor Sales Decrease 2.9% Month-to-Month in November

WASHINGTON—Jan. 9, 2023—The Semiconductor Industry Association (SIA) today announced global semiconductor industry sales were $45.5 billion during the month of November 2022, a decrease of 2.9% compared to the October 2022 total of $46.9 billion and 9.2% less than the November 2021 total of $50.0 billion. Monthly sales are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.

Source: Global Semiconductor Sales Decrease 2.9% Month-to-Month in November – Semiconductor Industry Association

TSMC to begin 3nm mass production

Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) on Saturday said that it would hold a ceremony on Thursday to mark the beginning of mass production using its 3-nanometer process. The company is to mark the placing of the final beam at its Fab 18 in the Southern Taiwan Science Park (南部科學園區) in Tainan. It would also detail its plans for expanding 3-nanometer production at the facility in the coming years, TSMC said.

Source: TSMC to begin 3nm mass production – Taipei Times

US vs China – “semiconductor arms race” in microelectronics 

In a recent article, Foreign Affairs – a New York-based journal of international relations, predicted the inevitability of an “economic arms race” between the US and China. This might primarily affect the production of microelectronics, and Washington has already shown its strong desire to use any means available, including non-market ones, to win this race – a 100-percent American tactic to come on top of it in everything, no matter what, if possible, at the expense of others.

Source: US vs China – “semiconductor arms race” in microelectronics – Modern Diplomacy

The Rise Of Copper Wires In Automotive ICs

In 2011, the price of Gold (Au) surged to $1900/oz which had a drastic impact on Wirebonded ICs using Au wires. IC suppliers scrambled to convert from Au to copper (Cu) wire on as many products as they could. However, automotive ICs were reluctant to make the jump due to lack of reliability data and performance track-record. However, today’s automotive ICs are big users of Cu wires driven by cost and reliability considerations.

Source: The Rise Of Copper Wires In Automotive ICs

TSMC confirms plans to make top-end chips in US 

Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) founder Morris Chang (張忠謀) yesterday confirmed that the company plans to produce its most advanced 3-nanometer chips in the US as part of the company’s phase 2 plan at its plant in Phoenix, Arizona.The 91-year-old entrepreneur, who has been appointed as Taiwan’s envoy to APEC six times, yesterday morning held a news conference at the Presidential Office Building to discuss his delegation’s accomplishments at this year’s APEC Economic Leaders’ Week in Bangkok, which ended on Saturday.

Source: TSMC confirms plans to make top-end chips in US – Taipei Times

EASii IC announces first silicon for its DVB-S2X satellite Modem ASIC

EASii IC announces its satellite modem ASIC, EZID211 also known as Oxford-2. The Oxford-2 is aimed at the earth-segment satellite communication market. Targeted applications include: internet via satellite user terminals covering GEO, MEO and LEO constellations, aero-mobile, earth observation, cellular backhaul, IP trunking, IOT and many other applications. The Oxford-2 is compliant with the DVB-S2 standard ETSI EN 302 307-2 and implements the latest S2X, adaptive coding and modulation (ACM), Very Low Signal to Noise Ratio (VLSNR) and super frame functionality.

Source: EASii IC announces first silicon for its DVB-S2X satellite Modem ASIC

The cost of America’s ban on Chinese chips 

The advice “dig two graves, before you set out” applies to anyone bent on revenge. An old aphorism is hardly going to divert the US from its mission to restrict Chinese access to its world-beating technology, slowing the progress of its rival towards self-sufficiency in high-performance chips.However, American policymakers are unlikely to have fully appreciated the corollary of splitting the world semiconductor supply chain in two: far higher costs for western manufacturers and their customers.

Source: Lex in-depth: the cost of America’s ban on Chinese chips | Financial Times

U.S. Suppliers Halt Operations at Top Chinese Memory Chip Maker 

China’s memory-chip industry is already facing a shortage of U.S. parts and labor. The Wall Street Journal reports that some of America’s leading chip-equipment manufacturers are pulling workers from China’s largest chip maker because of new restrictions on semiconductor exports.

Source: U.S. Suppliers Halt Operations at Top Chinese Memory Chip Maker | SupplyChainBrain