Rochester Electronics Finalizes Purchase of Hentec/RPS Odyssey 1325 Lead Tinning System
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities. Hentec Industries/RPS Automation is pleased to announce that Rochester Electronics has finalized the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine. The Odyssey 1325 is a MIL spec complaint high-volume, high-mix component lead tinning machine equipped with […]

